Hou, Hongyu, and Feng Wu. “AUTOMATED DEFECT INSPECTION ALGORITHM FOR SEMICONDUCTOR-PACKAGED CHIPS”. International Journal of Industrial Engineering: Theory, Applications and Practice 27, no. 5 (April 29, 2021). Accessed November 25, 2024. https://ijietap.journals.publicknowledgeproject.org/ijietap/index.php/ijie/article/view/6161.